Approx. 60 min
In this webinar we will present a novel workflow that starts from a Package
and PCB layout and yields a high fidelity circuit simulation with signal
integrity and power integrity being considered concurrently in the same model.
We will give guidelines on what material models should to be used and how to
extract an equivalent circuit model that is reliable from DC up to multiple
GHz. We will develop these guidelines on a test vehicle before applying them to
Вебинар проводится на английском языке!